Tag: Flying Probe

Finished Board SpecificationsLayer Count (FR-4)1 – 20 layersHDI1–3阶 (mechanical blind or laser blind vias)Board Thickness0.6 – 3.2 mm (thickness varies with layer count)Thickness Tolerance (≥ 1.0 mm)±10%Thickness Tolerance (< 1.0 mm)±0.10 mmMax Board

10 AOI stations + WTD flying probe + bed-of-nails fixtures. Every board optically and electrically tested before shipping.

ATG flying probe testers. Continuity and isolation on every net, no fixture needed. 6 machines for fast prototype and production turnaround.

Wangtongda fully automatic tester GL231108B1045A + ATG flying probe. 100% net coverage without custom fixture. Fast prototype turnaround.

ICT testing machine. In-circuit test verifies every electrical net — component values, shorts & opens. Bed-of-nails for volume production. Flying probe for prototypes. Keysight / Teradyne.

Flying Probe ICT uses motorized high-precision probes to verify every component value, diode polarity, and net continuity — no custom test fixture required. Ideal for prototypes, NPI runs, and small-batch PCBA. Test program generated directly from CA

2.60 mm Thick · 4/4 mil Trace/Space · 0.20mm Micro-Via at 12.8 Aspect Ratio · High-Coverage ENIG · Double-Sided High-Density BGA · Case Study: 10-Layer Multimedia Development Board

10-layer high-precision multilayer main control PCB: 1.60mm, 4/4 mil, ENIG, high-density BGA. Build-to-print from Gerber files. Full DFM, symmetrical lamination. RFQ

2.60 mm Thick · 4/5 mil Trace/Space · ENIG · 0.19 mm Micro-Via · Case Study: 10G Optical Fiber Transmission Board

ICT (In-Circuit Test) measures individual component values through a bed-of-nails fixture — catching wrong resistors, reversed diodes, and solder shorts in seconds. FCT (Functional Test) powers up the board and validates it performs its intended func

PCB testing is not a luxury — it is the line between shipping confidence and shipping risk. This guide maps the full testing pyramid from incoming QC through SPI, AOI, ICT, FCT, and system-level validation, explaining what each stage catches and why